# DMG MORI LASERTEC 30 SLM 3rd Generation

Hardware · `LASERTEC 30 SLM 3rd Generation` · verification: source checked

The LASERTEC 30 SLM 3rd Generation is a powder-bed additive manufacturing machine that builds parts by selective laser melting. It has a 325 x 325 x 400 mm work area, up to 1,000 W laser power, and can be configured with single, dual, or quad lasers. The machine uses CELOS X software with easyAM workflows and supports OPC UA, MQTT, and MTConnect connectivity.

## Specification

| Property | Value |
|---|---|
| Category | additive machine |
| Travel X | 325 mm |
| Travel Y | 325 mm |
| Travel Z | 400 mm |
| Table load | 400 kg |

## Connected

- Manufacturer: [DMG MORI](https://machineschema.com/manufacturer/dmg-mori.md)
- Protocols: [MQTT](https://machineschema.com/protocol/mqtt.md), [MTConnect](https://machineschema.com/protocol/mtconnect.md), [OPC UA](https://machineschema.com/protocol/opc-ua.md)

## Safety

- Collision protection system is included on the bi-directional recoating system.
- Protective glass monitoring detects smoke residues and weld penetrations.
- Powder bed monitoring detects anomalies.
- Powder handling uses a closed material cycle and integrated sieving and drying under inert gas atmosphere.

## Study notes

- The machine can be equipped with single-, dual-, or quad-laser configurations with full overlap.
- Focus diameter is 80 µm and minimum layer thickness is 30 µm.
- Maximum laser power is 1,000 W.
- The build container is exchangeable to reduce job-to-job time.
- Recoating is bi-directional.
- CELOS X software provides easyAM guided workflows and a maintenance app.
- The machine frame is a thermosymmetric casting, and the process chamber is floating.
- Active temperature compensation is used for z-axis positioning.
- rePLUG is a modular powder module for automated powder handling and recycling; one material is used per rePLUG.
- rePLUG includes integrated sieving and powder drying under inert gas and precise weight detection in the main tank.
- An optional rePLUG FLEX module is available for material and process parameter development.
- Connectivity includes OPC UA, MQTT, and MTConnect.

## Sources

1. [LASERTEC 30 SLM 3rd Generation - ADDITIVE MANUFACTURING Machines - DMG MORI](https://en.dmgmori.com/products/machines/additive-manufacturing/powder-bed/lasertec-30-slm-3rd) (accessed 2026-10-25)

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